Ukhuselo olusetyenziswa kwiimveliso zocingo kunye neentambo zineembono ezimbini ezahlukeneyo ngokupheleleyo: ukukhuselwa kwe-electromagnetic kunye nokukhusela indawo yombane. Ukukhusela i-electromagnetic shielding yenzelwe ukuthintela iintambo ezisasaza imiqondiso ye-high-frequency (ezifana neentambo ze-RF kunye neentambo zombane) ekubangeleni uphazamiseko lwangaphandle okanye ukuthintela amaza ombane ombane angaphandle ukuba angaphazamisani neentambo ezihambisa imisinga ebuthathaka (efana nomqondiso okanye iintambo zokulinganisa), kunye nokunciphisa i-crosstalk phakathi kweengcingo. Ukukhusela intsimi yombane yenzelwe ukulinganisa intsimi yombane eyomeleleyo kumphezulu we-conductor okanye i-insulation surface ye-medium-and high-voltage power cables.
1. Ulwakhiwo kunye neeMfuno zoMbane wokuKhusela uMbane
Ukukhuselwa kweentambo zombane kubandakanya ukukhusela i-conductor, ukhuselo lokugquma, kunye nokukhusela ngesinyithi. Ngokwemigangatho efanelekileyo, iintambo ezinombane olinganiselweyo omkhulu kune-0.6 / 1kV kufuneka zibe ne-metallic shielding layer, enokuthi ifakwe kwi-core insulated core okanye kwi-multi-core stranded cable core. Kwiintambo ze-XLPE-i-insulated ezine-voltage ezilinganisiweyo ezingekho ngaphantsi kwe-3.6 / 6kV kunye neentambo ze-EPR ezibhityileyo ezinombane olinganisiweyo ongekho ngaphantsi kwe-3.6/6kV (okanye iintambo ezingqingqwa ezingqingqwa ezinombane olinganiselweyo ongekho ngaphantsi kwe-6/10kV), izakhiwo zokhuselo ze-semi-conductive zangaphakathi nezingaphandle nazo ziyafuneka.
(1) I-Conductor Shielding kunye ne-Insulation Shielding
Ikhusi ye-conductor (i-internal semi-conductive shielding) kufuneka ingabi yintsimbi, iqulethe imathiriyeli ye-semi-conductive ekhutshiweyo okanye i-tape ye-semi-conductive ehlanganiswe kwi-conductor elandelwa yi-extruded semi-conductive layer.
Ukhuselo lwe-insulation (isikhuselo sangaphandle semi-conductive) ngumaleko ongeyiyo isinyithi semi-conductive ogqithiselwe ngokuthe ngqo kumphezulu ongaphandle wombindi ngamnye ogqunyiweyo, onokuthi ubotshwe ngokuqinileyo kuwo okanye uxobukeke ukusuka kwisigqubuthelo. Iileya ezikhutshiweyo zangaphakathi nangaphandle zesemi-conductive kufuneka zibotshwe ngokuqinileyo kwi-insulation, kunye nojongano olugudileyo, kungabikho manqaku acacileyo e-strand, kwaye akukho macala abukhali, amasuntswana, amanqaku okutshisa, okanye imikrwelo. Ukuxhathisa ngaphambi nasemva kokuguga akufuneki kudlule kwi-1000 Ω·m yomaleko okhuselayo we-conductor kunye ne-500 Ω·m yomaleko okhuselayo wokugquma.
Izinto zokukhusela ezingaphakathi kunye nezangaphandle ze-semi-conductive zenziwa ngokuxuba izinto ezihambelanayo zokugquma (ezifana ne-polyethylene edibeneyo, i-ethylene-propylene rubber, njl.) kunye ne-carbon black, i-antioxidants, i-ethylene-vinyl acetate copolymer, kunye nezinye izongezo. Iincinci zekhabhoni ezimnyama kufuneka zihlakazwe ngokufanayo ngaphakathi kwepolymer, ngaphandle kwe-agglomeration okanye ukusasazwa kakubi.
Ubukhulu bemigangatho yangaphakathi nangaphandle ye-semi-conductive yokukhusela inyuka kunye nenqanaba lombane. Ngenxa yokuba amandla ebala lombane kumaleko wokugquma angaphezulu ngaphakathi nangaphantsi ngaphandle, ubukhulu bomaleko okhuselo lwesemi-conductive nawo kufuneka bube bukhulu ngaphakathi kunangaphandle. Ngaphambili, isikhuselo semi-conductive sangaphandle senziwe ngqindilili kancinci kunesangaphakathi ukuthintela imikrwelo ngenxa yolawulo olubi lwe-sag okanye ukuhlatywa okubangelwa ziiteyiphu zobhedu eziqina kakhulu. Ngoku, ngokujongwa kwe-sag ngokuzenzekelayo kwi-intanethi kunye neeteyiphu ezithambileyo zobhedu, umaleko ongaphakathi okhuselayo we-semi-conductive kufuneka wenziwe ube ngqindilili kancinane okanye ulingane nomaleko wangaphandle. Kwiintambo ze-6–10–35 kV, ubukhulu bomaleko wangaphakathi ngokuqhelekileyo yi-0.5–0.6–0.8 mm.
(2) Ukukhuselwa kwentsimbi
Iikheyibhile ezinombane olinganisiweyo ongaphezulu kwe-0.6/1kV kufuneka zibe nentsimbi ekhuselayo. I-metallic shielding layer kufuneka isetyenziswe kwi-core insulated okanye i-cable core. Ukhuselo lwesinyithi kufuneka luqulathe iteyiphu enye okanye ngaphezulu, iibraids zetsimbi, iileya ezinzulu zeengcingo zetsimbi, okanye indibaniselwano yeengcingo zetsimbi kunye neeteyiphu zetsimbi.
EYurophu nakwamanye amazwe aphuhlileyo, ngenxa yokusetyenziswa kweenkqubo zokuxhathisa-ezisekelwe kwi-double-circuit systems ezinemisinga ephezulu ye-short-circuit, i-copper wire shielding isetyenziswa ngokuqhelekileyo. Abanye abavelisi bafakela iingcingo zobhedu kwi-sheath yokwahlula okanye kwi-sheath yangaphandle ukunciphisa i-diameter yentambo. E-China, ngaphandle kwezinye iiprojekthi eziphambili ezisebenzisa i-resistance-grounded double-circuit systems, uninzi lweenkqubo zisebenzisa i-arc-suppression coil-grounded power supply single-circuit, enciphisa i-short-circuit current ibe yincinci, ukuze kusetyenziswe ukukhuselwa kweteyiphu yobhedu. Iifektri zekhebhula zithengiweyo iiteyiphu zobhedu eziqinileyo ngokunqunyulwa kunye nokuqhotyoshwa ukuze kufikelelwe ubude obuthile kunye nokomelela okuqinileyo (kakhulu kuya kukrwela umaleko okhuselayo, uthambile kakhulu uya kushwabana) phambi kokusetyenziswa. Iiteyiphu zobhedu ezithambileyo kufuneka zihambelane ne-GB/T11091-2005 yeCopper Tape yeeCables.
Ukhuselo lweteyiphu yobhedu kufuneka luqulathe umaleko omnye weteyiphu ethambileyo yobhedu okanye imigangatho emibini yeteyiphu ethambileyo esongelwe ngobhedu enezikhewu. Umyinge we-overlap rate we-tape yobhedu kufuneka ube yi-15% yobubanzi bayo (ixabiso eliphantsi), kwaye ubuncinci bezinga lokugqithana akufanele libe ngaphantsi kwe-5%. Ubuncinci be-tape yobhedu kufuneka bube ubuncinane be-0.12 mm kwiintambo ze-single-core kunye ne-0.10 mm ubuncinane kwi-multi-core cables. Ubuncinci obuncinci betape yobhedu akufanele bube ngaphantsi kwe-90% yexabiso eliqhelekileyo. Ngokuxhomekeke kwi-diameter yangaphandle ye-insulation shielding (≤25 mm okanye> 25 mm), ububanzi be-tape yobhedu ngokuqhelekileyo bu-30-35 mm.
Ukukhuselwa kweengcingo zobhedu kwenziwa ngeengcingo ezithambileyo zobhedu, ezikhuselwe nge-counter-helical wrapping of coppers or copper tapes. Ukuchasana kwayo kufuneka kuhlangabezane neemfuno ze-GB / T3956-2008 Conductors of Cables, kunye nommandla wayo onqamlekileyo onqamlekileyo kufuneka unqunywe ngokuhambelana namandla akhoyo. Isikhuselo socingo sobhedu sinokufakwa phezu kwesheti yangaphakathi yeentambo ezingundoqo ezintathu okanye ngokuthe ngqo ngaphezulu kwesigqubuthelo, umaleko ongaphandle okhuselayo owenziweyo, okanye isingxobo esifanelekileyo sangaphakathi seentambo ezinondoqo omnye. Umsantsa ophakathi phakathi kweengcingo zobhedu ezikufutshane akufanele udlule kwi-4 mm. Umsantsa oqhelekileyo G ubalwa kusetyenziswa ifomula:
apho:
D - ububanzi bentambo yentambo phantsi kokukhusela ucingo lobhedu, kwi-mm;
d - ububanzi bocingo lobhedu, kwi-mm;
n – inani leengcingo zobhedu.
2. Indima yeeNqaku zokuKhusela kunye noBudlelwane babo kumanqanaba ombane
(1) Indima yoKhuselo lwaNgaphakathi naNgaphandle lweSemi-Conductive
Iikhondaktha zeentambo zidla ngokudityaniswa ukusuka kwiingcingo ezininzi ezinemisonto. Ngexesha le-insulation extrusion, izikhewu, i-burrs, kunye nezinye izitenxo zomphezulu zinokubakho phakathi komphezulu womqhubi kunye ne-insulation layer, ebangela ukugxilwa kwentsimi yombane, okukhokelela ekukhutshweni kwesithuba somoya wendawo kunye nokukhutshwa kwemithi, kunye nokunciphisa ukusebenza kwe-dielectric. Ngokukhupha umaleko we-semi-conductive material (i-conductor shielding) phezu kwendawo yomqhubi, iqinisekisa ukudibanisa okuqinileyo kunye ne-insulation. Ngenxa yokuba i-semi-conductive layer kunye ne-conductor inamandla afanayo, nokuba kukho izikhewu phakathi kwabo, akuyi kubakho ntshukumo yentsimi yombane, ngaloo ndlela ikhusela ukukhutshwa kwenxalenye.
Ngokufanayo, kukho izikhewu phakathi kwendawo yokugquma yangaphandle kunye ne-metallic sheath (okanye i-metallic shielding), kwaye okukhona inqanaba lombane liphezulu, kokukhona ukukhutshwa komsantsa womoya kuya kwenzeka. Ngokukhupha umaleko we-semi-conductive (i-insulation shielding) kwindawo yangaphandle ye-insulation surface, i-equipotential surface yenziwe nge-metallic sheath, ukuphelisa amasimi ombane kwizithuba kunye nokuthintela ukukhutshwa kwenxalenye.
(2) Indima yeMetallic Shielding
Imisebenzi ye-metallic shielding ibandakanya: ukuthwala i-capacitive current phantsi kweemeko eziqhelekileyo, ukusebenza njengendlela yombane we-short-circuit current ngexesha leempazamo; ukuvala intsimi yombane ngaphakathi kwe-insulation (ukunciphisa ukuphazamiseka kwe-electromagnetic yangaphandle) kunye nokuqinisekisa indawo yombane ye-radial efanayo; ukusebenza njengomgca ongathathi hlangothi kwiinkqubo ezine-four-phase ukuthwala i-current unbalanced; kunye nokubonelela ngokhuseleko lokuthintela amanzi ngeradial.
Ixesha lokuposa: Jul-28-2025