1. Intshayelelo
Ikhebula lonxibelelwano ekuhanjisweni kweempawu eziphezulu ze-frequency, abaqhubi baya kuvelisa umphumo wesikhumba, kunye nokunyuka kwesantya somqondiso ogqithisiweyo, umphumo wesikhumba unzima ngakumbi. Okubizwa ngokuba yimpembelelo yesikhumba kubhekiselele ekuhanjisweni kwemiqondiso ecaleni kwendawo yangaphandle yomqhubi wangaphakathi kunye nomgangatho wangaphakathi womqhubi wangaphandle wentambo ye-coaxial xa i-frequency yesignali edlulisiweyo ifikelela kwii-kilohertz ezininzi okanye amashumi amawaka e-hertz.
Ngokukodwa, kunye nexabiso lamazwe ngamazwe lobhedu oluphezulu kunye nemithombo yobhedu kwindalo iyancipha ngakumbi nangakumbi, ngoko ke ukusetyenziswa kwentsimbi yobhedu okanye i-aluminiyam yobhedu endaweni yabaqhubi bobhedu, ibe ngumsebenzi obalulekileyo wocingo kwaye imboni yokuvelisa intambo, kodwa kunye nokukhuthazwa kwayo kunye nokusetyenziswa kwendawo yemarike enkulu.
Kodwa i-wire plating yobhedu, ngenxa yonyango lwangaphambili, i-nickel yangaphambili kunye nezinye iinkqubo, kunye nefuthe lesisombululo se-plating, kulula ukuvelisa ezi ngxaki zilandelayo kunye neziphene: i-wire blackening, i-pre-plating ayilungile. , Umaleko ophambili we-plating ngaphandle kwesikhumba, okukhokelela ekuveliseni ucingo lwenkunkuma, inkunkuma yezinto eziphathekayo, ukwenzela ukuba iindleko zokuvelisa imveliso zanda. Ngoko ke, kubaluleke kakhulu ukuqinisekisa umgangatho wokwaleka. Eli phepha lixubusha ngokukodwa imigaqo yenkqubo kunye neenkqubo zokuvelisa ucingo lwensimbi yobhedu nge-electroplating, kunye nezizathu eziqhelekileyo zeengxaki zomgangatho kunye neendlela zesisombululo. 1 Inkqubo yokufakwa kwentsimbi yobhedu kunye nezizathu zayo
1. 1 Unyango lwangaphambili lwecingo
Okokuqala, ucingo luntywiliselwa kwisisombululo se-alkaline kunye ne-pickling, kwaye i-voltage ethile isetyenziswe kwi-wire (anode) kunye ne-plate (cathode), i-anode ibeka inani elikhulu le-oksijini. Indima ephambili yezi gesi zezi: enye, amaqamza anobundlobongela kumphezulu wocingo lwentsimbi kunye ne-electrolyte yayo ekufutshane idlala ukuphazamiseka komatshini kunye nesiphumo sokuhluba, ngaloo ndlela ikhuthaza i-oyile ukusuka kumphezulu wocingo lwentsimbi, ikhawulezise inkqubo ye-saponification kunye ne-emulsification. ioli kunye namafutha; okwesibini, ngenxa yamaqamza amancinci ancanyathiselwe kujongano phakathi kwesinyithi kunye nesisombululo, kunye namaqamza kunye nocingo lwentsimbi ngaphandle, amaqamza aya kubambelela kwintambo yentsimbi eneoli eninzi kumphezulu wesisombululo, ke ngoko, Amaqamza aya kuzisa i-oyile eninzi ebambelela kwintambo yentsimbi kumphezulu wesisombululo, ngaloo ndlela ikhuthaza ukususwa kweoyile, kwaye kwangaxeshanye, akukho lula ukuvelisa i-hydrogen embrittlement ye-anode, ukuze i-oyile ilunge. iplating inokufumaneka.
1. 2 Ukufakwa kocingo
Okokuqala, ucingo luphathwa kwangaphambili kwaye lufakwe ngaphambili nge-nickel ngokucwiliswa kwisisombululo sokucoca kunye nokusebenzisa i-voltage ethile kwi-wire (cathode) kunye neplate yethusi (anode). Kwi-anode, ipleyiti yobhedu ilahlekelwa zii-electron kwaye yenze ii-ion ze-divalent zethusi zasimahla kwindawo yokuhlambela ye-electrolytic (plating):
Cu – 2e→Cu2+
Kwi-cathode, ucingo lwentsimbi luphinde lwenziwe ngombane kwaye ii-ion ze-divalent zethusi zifakwe kucingo ukuze zenze ucingo lwentsimbi olufakwe ubhedu:
Cu2 + + 2e→ Cu
Cu2 + + e→ Cu +
Cu + + e→ Cu
2H + + 2e→ H2
Xa isixa se-asidi kwisisombululo se-plating singonelanga, i-cuprous sulphate i-hydrolysed ngokulula ukwenza i-cuprous oxide. I-cuprous oxide ibanjwe kuluhlu lwe-plating, iyenza ikhululeke. Cu2 SO4 + H2O [Cu2O + H2 SO4
I. Amacandelo Angundoqo
Iintambo zangaphandle zangaphandle zihlala zinemicu engenanto, ityhubhu ekhululekileyo, izinto ezithintela amanzi, izinto ezomelezayo, kunye neshethi yangaphandle. Ziza kwizakhiwo ezahlukeneyo ezinje ngoyilo lwetyhubhu esembindini, i-layer stranding, kunye nolwakhiwo lwamathambo.
Iifiber ezingenanto zibhekisela kwimicu ye-optical yasekuqaleni kunye nobubanzi obuyi-250 micrometers. Ngokuqhelekileyo babandakanya umaleko ongundoqo, umaleko wokugquma, kunye nomaleko wokugquma. Iindidi ezahlukeneyo zeentsinga ezingenanto zineesayizi ezahlukeneyo zomaleko ongundoqo. Ngokomzekelo, iifayili ze-OS2 ze-single-mode ziyi-9 micrometers, ngelixa i-multimode OM2 / OM3 / OM4 / OM5 iifayili ziyi-50 micrometers, kunye ne-multimode OM1 fibers yi-62.5 micrometers. Iintsinga ezingenanto zihlala zinekhowudi zombala zokwahlula phakathi kweentsinga ezininzi.
Iityhubhu ezixengayo zihlala zenziwe ngobunjineli obuphezulu bePBT yeplastiki kwaye zisetyenziselwa ukuhlalisa imicu engenanto. Babonelela ngokhuseleko kwaye bazaliswe ngejeli yokuthintela amanzi ukukhusela ukungena kwamanzi okungonakalisa imicu. Ijeli ikwasebenza njengesithinteli ukuthintela umonakalo wefiber kwiimpembelelo. Inkqubo yokwenziwa kweetyhubhu ezikhululekileyo ibalulekile ukuze kuqinisekiswe ubude obugqithileyo befiber.
Izinto zokuthintela amanzi zibandakanya igrisi yentambo yokuthintela amanzi, intambo yokuthintela amanzi, okanye umgubo wokuthintela amanzi. Ukwandisa ngakumbi isakhono sokuvala amanzi sisonke sentambo, eyona ndlela iphambili kukusebenzisa igrisi yokuthintela amanzi.
Izinto ezomelezayo ziza kwiintlobo zetsimbi kunye nezingezizo ezentsimbi. Ezentsimbi zihlala zenziwe ngeengcingo zentsimbi ezinephosphate, iiteyiphu zealuminiyam, okanye iiteyiphu zentsimbi. Izinto ezingezizo ezentsimbi zenziwe ngokuyintloko ngezinto ze-FRP. Nokuba yeyiphi na imathiriyeli esetyenzisiweyo, ezi zinto kufuneka zinike amandla omatshini ayimfuneko ukuhlangabezana neemfuno ezisemgangathweni, kubandakanya ukuchasana noxinzelelo, ukugoba, impembelelo kunye nokujija.
Iishethi zangaphandle kufuneka ziqwalasele imeko-bume yokusetyenziswa, kubandakanya ukuthintela amanzi, ukuxhathisa kwe-UV, kunye nokumelana nemozulu. Ngoko ke, izinto ezimnyama ze-PE zisetyenziswa ngokuqhelekileyo, njengoko iimpawu zayo ezibalaseleyo zomzimba kunye neekhemikhali ziqinisekisa ukufaneleka kofakelo lwangaphandle.
2 Izizathu zeengxaki zekhwalithi kwinkqubo yokubeka ubhedu kunye nezisombululo zazo
2. 1 Impembelelo yonyango lwangaphambili lwentambo kwi-plating layer Unyango lwangaphambili lwecingo lubaluleke kakhulu ekuveliseni i-copper-clad steel wire nge-electroplating. Ukuba ifilimu yeoli kunye ne-oxide ebusweni bocingo ayipheliswanga ngokupheleleyo, ke i-nickel layer pre-plated ayifakwanga kakuhle kwaye i-bonding ihlwempuzekile, ekugqibeleni iya kukhokelela ekuweni kwe-copper plating layer. Ngoko ke kubalulekile ukubeka iliso kwi-concentration ye-alkaline kunye ne-pickling liquids, i-pickling kunye ne-alkali yangoku kunye nokuba iimpompo ziqhelekileyo, kwaye ukuba azikho, kufuneka zilungiswe ngokukhawuleza. Iingxaki ezisemgangathweni eziqhelekileyo kunyango lwangaphambili lwentsimbi yensimbi kunye nezisombululo zazo ziboniswa kwiThebhile
2. 2 Ukuzinza kwesisombululo sangaphambili se-nickel sinquma ngokuthe ngqo umgangatho we-pre-plating layer kwaye idlala indima ebalulekileyo kwisinyathelo esilandelayo sobhedu. Ngoko ke, kubalulekile ukuhlalutya rhoqo kwaye ulungelelanise umlinganiselo wokubunjwa kwesisombululo se-nickel esifakwe ngaphambili kunye nokuqinisekisa ukuba isisombululo se-nickel esifakwe ngaphambili sicocekile kwaye asingcoliswanga.
2.3 Impembelelo yesisombululo esiphambili se-plating layer kwi-plating layer Isisombululo se-plating sine-sulphate yethusi kunye ne-sulfuric acid njengamacandelo amabini, ukubunjwa komlinganiselo kubeka ngokuthe ngqo umgangatho we-plating layer. Ukuba i-concentration ye-sulphate yethusi iphezulu kakhulu, i-crystals ye-sulphate yethusi iya kuhlanjululwa; ukuba i-concentration ye-sulphate yethusi iphantsi kakhulu, ucingo luya kutshiswa lula kwaye ukusebenza kakuhle kwe-plating kuya kuchaphazeleka. I-asidi ye-Sulfuric inokuphucula ukuqhutyelwa kombane kunye nokusebenza ngokufanelekileyo kwesisombululo se-electroplating, ukunciphisa ukuxinwa kwee-ion zobhedu kwisisombululo se-electroplating (i-ion effect efanayo), ngaloo ndlela iphucula i-cathodic polarization kunye nokusasazeka kwesisombululo se-electroplating, ukwenzela ukuba ukuxinana kwangoku. ukunciphisa ukunyuka, kunye nokuthintela i-hydrolysis ye-cuprous sulphate kwisisombululo se-electroplating kwi-cuprous oxide kunye nemvula, ukwandisa ukuzinza kwesisombululo se-plating, kodwa kunciphisa i-anodic polarisation, ehambelana nokuchithwa okuqhelekileyo kwe-anode. Nangona kunjalo, kufuneka kuqatshelwe ukuba umxholo ophezulu we-sulfuric acid uya kunciphisa ukunyibilika kwe-sulphate yethusi. Xa umxholo we-asidi ye-sulfuric kwisisombululo se-plating asanelanga, i-sulphate yethusi i-hydrolysed ngokulula kwi-cuprous oxide kwaye ifakwe kwi-plating layer, umbala woluhlu uba mnyama kwaye ukhulule; xa kukho ukugqithiswa kwe-asidi ye-sulfuric kwisisombululo se-plating kunye nesiqulatho setyuwa sobhedu singonelanga, i-hydrogen iya kukhutshwa ngokuyinxenye kwi-cathode, ukuze umphezulu we-plating layer ubonakale unebala. I-Phosphorus ipleyiti yobhedu umxholo we-phosphorus nayo inempembelelo ebalulekileyo kumgangatho wokugquma, umxholo we-phosphorus kufuneka ulawulwe kuluhlu lwe-0. 04% ukuya ku-0. 07%, ukuba ngaphantsi kwe-0. 02%, kunzima ukwenza ifilimu yokuthintela ukuveliswa kweeyoni zethusi, ngaloo ndlela ukwandisa umgubo wobhedu kwisisombululo se-plating; ukuba umxholo we-phosphorus ongaphezulu kwe-0. 1%, uya kuchaphazela ukuchithwa kwe-anode yobhedu, ukwenzela ukuba umxholo we-ion ze-bivalent zethusi kwisisombululo se-plating uyancipha, kwaye uvelise udaka oluninzi lwe-anode. Ukongezelela, ipleyiti yobhedu kufuneka ihlanjululwe rhoqo ukukhusela i-anode sludge ekungcoliseni isisombululo se-plating kwaye ibangele uburhabaxa kunye ne-burrs kwi-plating layer.
3 Isiphelo
Ngokucutshungulwa kwezi nkalo zikhankanywe ngasentla, ukunamathela kunye nokuqhubeka kwemveliso kulungile, umgangatho uzinzile kwaye ukusebenza kuhle kakhulu. Nangona kunjalo, kwinkqubo yokuveliswa kwangempela, kukho izinto ezininzi ezichaphazela umgangatho woluhlu lwe-plating kwinkqubo yokucoca, emva kokuba ingxaki ifunyenwe, kufuneka ihlalutywe kwaye ifundwe ngexesha kwaye amanyathelo afanelekileyo kufuneka athathwe ukuyisombulula.
Ixesha lokuposa: Jun-14-2022