1. Intshayelelo
Intambo yonxibelelwano ekudlulisweni kwemiqondiso ye-high-frequency, ii-conductors ziya kuvelisa isiphumo sesikhumba, kwaye ngokwanda kwesantya sesignali edluliselweyo, isiphumo sesikhumba siba sibi ngakumbi nangakumbi. Isiphumo esibizwa ngokuba sisikhumba sibhekisa ekudlulisweni kwemiqondiso kumphezulu wangaphandle we-conductor yangaphakathi kunye nomphezulu wangaphakathi we-coaxial cable xa isantya sesignali edluliselweyo sifikelela kwiikhilohertz ezininzi okanye amashumi amawaka e-hertz.
Ngokukodwa, njengoko ixabiso lehlabathi lobhedu linyuka kwaye imithombo yobhedu isiya inqaba, ngoko ke ukusetyenziswa kwentsimbi yesinyithi egqunywe lubhedu okanye ucingo lwe-aluminium olugqunywe lubhedu endaweni yee-conductors zobhedu, kube ngumsebenzi obalulekileyo kushishino lokuvelisa ucingo kunye neentambo, kodwa kwanokukhuthazwa kwalo ngokusebenzisa indawo enkulu yemarike.
Kodwa ucingo olukwiplating yobhedu, ngenxa yonyango lwangaphambi konyango, i-nickel yangaphambili kunye nezinye iinkqubo, kunye nempembelelo yesisombululo seplating, kulula ukuvelisa ezi ngxaki zilandelayo kunye neziphene: ukumnyama kwentambo, iplating yangaphambi kokucoca ayilunganga, umaleko ophambili weplating uphuma eluswini, okubangela ukuveliswa kwentambo yenkunkuma, inkunkuma yezinto, ukuze iindleko zokwenziwa kwemveliso zinyuke. Ke ngoko, kubaluleke kakhulu ukuqinisekisa umgangatho wengubo. Eli phepha lixoxa kakhulu ngemigaqo yenkqubo kunye neenkqubo zokuveliswa kwentambo yentsimbi egqunywe ngobhedu nge-electroplating, kunye nezizathu eziqhelekileyo zeengxaki zomgangatho kunye neendlela zesisombululo. 1 Inkqubo yeplating yentsimbi egqunywe ngobhedu kunye nezizathu zayo
1. 1 Unyango lwangaphambi kocingo
Okokuqala, ucingo luntywiliselwa kwisisombululo se-alkaline kunye ne-pickling, kwaye i-voltage ethile ifakwa kwintambo (anode) kunye nepleyiti (cathode), i-anode ibangela i-oxygen eninzi. Indima ephambili yale gesi yile: enye, amaqamza anamandla kumphezulu wentambo yentsimbi kwaye i-electrolyte yayo ekufutshane idlala isiphumo sokushukuma kunye nokukrazula, ngaloo ndlela ikhuthaza ioyile ukusuka kumphezulu wentambo yentsimbi, ikhawulezise inkqubo ye-saponification kunye ne-emulsification yeoyile kunye negrisi; okwesibini, ngenxa yamaqamza amancinci anamathele kunxibelelwano phakathi kwesinyithi kunye nesisombululo, xa amaqamza kunye nentambo yentsimbi iphumile, amaqamza aya kunamathela kwintambo yentsimbi eneoyile eninzi kumphezulu wesisombululo, ngoko ke, kwi- Amaqamza aya kuzisa ioyile eninzi enamathele kwintambo yentsimbi kumphezulu wesisombululo, ngaloo ndlela ikhuthaza ukususwa kweoyile, kwaye kwangaxeshanye, akulula ukuvelisa i-hydrogen embrittlement ye-anode, ukuze kufunyanwe iplating elungileyo.
1. 2 Ukufakelwa kwentambo
Okokuqala, ucingo lulungiswa kwangaphambili kwaye lufakwe i-nickel ngokulifaka kwisisombululo seplating kwaye kusetyenziswe i-voltage ethile kwi-wire (cathode) kunye nepleyiti ye-copper (anode). Kwi-anode, ipleyiti ye-copper ilahlekelwa zii-electron kwaye yenze ii-ion ze-copper copper ezikhululekileyo kwi-electrolytic (plating) bath:
I-Cu – 2e→I-Cu2+
Kwi-cathode, ucingo lwentsimbi luphinda lusetyenziswe nge-electrolytic kwaye ii-ion ze-copper ezidivalent zifakwa kwintambo ukuze zenze ucingo lwentsimbi olugqunywe nge-copper:
Cu2 + + 2e→ Cu
Cu2 + + e→ Cu +
Cu + + e→ Cu
2H + + 2e→ H2
Xa ubungakanani be-asidi kwisisombululo seplating bunganele, i-cuprous sulphate itsalwa lula ukuze yenze i-cuprous oxide. I-cuprous oxide ibambeke kumaleko weplating, nto leyo eyenza ukuba ikhululeke. I-Cu2 SO4 + H2O [Cu2O + H2 SO4
I. Izinto eziphambili
Iintambo ze-optical zangaphandle zihlala zinemicu engenanto, ityhubhu ekhululekileyo, izinto ezithintela amanzi, izinto eziqinisayo, kunye nesheath yangaphandle. Ziza ngezakhiwo ezahlukeneyo ezifana noyilo lwetyhubhu ephakathi, ukuxinana kweeleya, kunye nolwakhiwo lwamathambo.
Iifayibha ezingenanto zibhekisa kwiifayibha ze-optical zokuqala ezinobubanzi obuyi-250 micrometers. Zihlala ziquka umaleko oyintloko, umaleko wokugquma, kunye nomaleko wokugquma. Iintlobo ezahlukeneyo zeefayibha ezingenanto zinobukhulu obahlukeneyo beefayibha eziphambili. Umzekelo, iifayibha ze-OS2 zemo enye zihlala ziyi-9 micrometers, ngelixa iifayibha ze-OM2/OM3/OM4/OM5 ezininzi ziyi-50 micrometers, kwaye iifayibha ze-OM1 ezininzi ziyi-62.5 micrometers. Iifayibha ezingenanto zihlala zinemibala ukuze zahlulwe phakathi kweefayibha ezinee-core ezininzi.
Iityhubhu ezikhululekileyo zihlala zenziwe ngeplastiki yobunjineli enamandla aphezulu i-PBT kwaye zisetyenziselwa ukuhlalisa iintsinga ezingenanto. Zibonelela ngokhuseleko kwaye zizaliswe yijeli ethintela amanzi ukuthintela ukungena kwamanzi okunokonakalisa iintsinga. Ijeli ikwasebenza njengesithinteli ukuthintela umonakalo wefayibha kwiimpembelelo. Inkqubo yokwenziwa kweetyhubhu ezikhululekileyo ibalulekile ukuqinisekisa ubude obugqithisileyo befayibha.
Izinto zokuthintela amanzi ziquka igrisi yokuthintela amanzi ngentambo, intambo yokuthintela amanzi, okanye umgubo wokuthintela amanzi. Ukuphucula ngakumbi amandla okuthintela amanzi ngentambo, indlela eqhelekileyo kukusebenzisa igrisi yokuthintela amanzi.
Izinto eziqinisayo ziza ngohlobo lwesinyithi kunye nolwesinyithi. Ezesinyithi zihlala zenziwe ngeengcingo zentsimbi ezine-phosphate, iitheyiphu ze-aluminium, okanye iitheyiphu zentsimbi. Izinto ezingezizo zesinyithi zenziwe ikakhulu ngezinto ze-FRP. Nokuba zeziphi izinto ezisetyenzisiweyo, ezi zinto kufuneka zinike amandla oomatshini afunekayo ukuhlangabezana neemfuno ezisemgangathweni, kubandakanya ukumelana noxinzelelo, ukugoba, impembelelo, kunye nokujika.
Izikhonkwane zangaphandle kufuneka ziqwalasele indawo yokusetyenziswa, kubandakanya ukuthintela amanzi, ukumelana ne-UV, kunye nokumelana nemozulu. Ke ngoko, izinto ezimnyama ze-PE zisetyenziswa rhoqo, njengoko iipropati zazo zomzimba nezekhemikhali ziqinisekisa ukuba zifanelekile ukufakwa ngaphandle.
2 Izizathu zeengxaki zomgangatho kwinkqubo yokugquma ubhedu kunye nezisombululo zazo
2. 1 Impembelelo yokulungiswa kwangaphambili kwentambo kumaleko wokugquma Ukulungiswa kwangaphambili kwentambo kubaluleke kakhulu ekuvelisweni kwentambo yentsimbi egqunywe ngobhedu ngokugquma nge-electroplating. Ukuba ifilimu yeoyile kunye ne-oxide kumphezulu wentambo ayisuswanga ngokupheleleyo, umaleko we-nickel ogqunywe kwangaphambili awugqunywanga kakuhle kwaye ukubopha kubuthathaka, nto leyo eya kukhokelela ekubeni umaleko ophambili wokugquma wentsimbi uwe. Kungoko ke kubalulekile ukujonga uxinano lwe-alkaline kunye nolwelo lokugquma, i-pickling kunye ne-alkaline current kunye nokuba iipompo ziqhelekile na, kwaye ukuba aziqhelekanga, kufuneka zilungiswe ngokukhawuleza. Iingxaki zomgangatho eziqhelekileyo ekulungisweni kwangaphambili kwentambo yentsimbi kunye nezisombululo zazo ziboniswe kwiTheyibhile
2. 2 Ukuzinza kwesisombululo se-pre-nickel kumisela ngokuthe ngqo umgangatho womaleko we-pre-plating kwaye kudlala indima ebalulekileyo kwinqanaba elilandelayo le-copper plating. Ke ngoko, kubalulekile ukuhlalutya rhoqo nokulungisa umlinganiselo wokwakheka kwesisombululo se-nickel esifakwe ngaphambili kunye nokuqinisekisa ukuba isisombululo se-nickel esifakwe ngaphambili sicocekile kwaye asingcoliswanga.
2.3 Impembelelo yesisombululo esiphambili sokugquma kumaleko wokugquma Isisombululo sokugquma siqulethe i-copper sulphate kunye ne-sulfuric acid njengezinto ezimbini, ukwakheka komlinganiselo kumisela ngokuthe ngqo umgangatho womaleko wokugquma. Ukuba uxinzelelo lwe-copper sulphate luphezulu kakhulu, iikristale ze-copper sulphate ziya kutsha; ukuba uxinzelelo lwe-copper sulphate luphantsi kakhulu, ucingo luya kutsha lula kwaye ukusebenza kakuhle kokugquma kuya kuchaphazeleka. I-Sulphuric acid inokuphucula ukuqhuba kombane kunye nokusebenza kakuhle kwamandla esisombululo se-electroplating, inciphise uxinzelelo lwee-ions zobhedu kwisisombululo se-electroplating (isiphumo esifanayo se-ion), ngaloo ndlela iphucula i-cathodic polarisation kunye nokusasazeka kwesisombululo se-electroplating, ukuze umda woxinano lwangoku unyuke, kwaye uthintele i-hydrolysis ye-cuprous sulphate kwisisombululo se-electroplating ibe yi-cuprous oxide kunye nemvula, inyuse uzinzo lwesisombululo sokugquma, kodwa ikwanciphisa i-anodic polarisation, ekhuthaza ukunyibilika okuqhelekileyo kwe-anode. Nangona kunjalo, kufuneka kuqatshelwe ukuba umxholo ophezulu we-sulfuric acid uya kunciphisa ukunyibilika kwe-copper sulphate. Xa umxholo we-sulfuric acid kwisisombululo seplating unganelanga, i-copper sulphate ifakwa ngokulula kwi-hydrolyzed ibe yi-cuprous oxide kwaye ibanjwe kwi-plating layer, umbala womaleko uba mnyama kwaye ukhululeke; xa kukho i-sulfuric acid engaphezulu kwisisombululo seplating kwaye umxholo wetyuwa yobhedu unganelanga, i-hydrogen iya kukhutshwa kancinci kwi-cathode, ukuze umphezulu womaleko weplating ubonakale unamabala. Umxholo we-phosphorus kwipleyiti yobhedu ye-phosphorus nawo unempembelelo ebalulekileyo kumgangatho wengubo, umxholo we-phosphorus kufuneka ulawulwe ukusuka kwi-0.04% ukuya kwi-0.07%, ukuba ungaphantsi kwe-0.02%, kunzima ukwenza ifilimu ukuthintela ukuveliswa kwee-ion zobhedu, ngaloo ndlela kwandisa umgubo wobhedu kwisisombululo seplating; Ukuba umxholo we-phosphorus ungaphezulu kwe-0.1%, uya kuchaphazela ukunyibilika kwe-anode ye-copper, ukuze umxholo wee-ion ze-copper ezi-bivalent kwisisombululo se-plating unciphe, kwaye uvelise udaka oluninzi lwe-anode. Ukongeza, ipleyiti ye-copper kufuneka ihlanjwe rhoqo ukuthintela i-anode sludge ekungcoliseni isisombululo se-plating kwaye ibangele uburhabaxa kunye ne-burrs kumaleko we-plating.
3 Isiphelo
Ngokusebenzisa ezi zinto zikhankanyiweyo apha ngasentla, ukunamathela kunye nokuqhubeka kwemveliso kulungile, umgangatho uzinzile kwaye ukusebenza kwayo kugqwesileyo. Nangona kunjalo, kwinkqubo yokwenyani yemveliso, kukho izinto ezininzi ezichaphazela umgangatho womaleko wokugquma kwinkqubo yokugquma, xa ingxaki ifunyenwe, kufuneka ihlalutywe kwaye ifundwe ngexesha kwaye kuthathwe amanyathelo afanelekileyo ukuyisombulula.
Ixesha lokuthumela: Juni-14-2022